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Process Engineer - Surface Mounted Technology

We are a company of innovators, game changers and entrepreneurs. As a prime contractor, we provide a broad range of communication, electronic and sensor systems used on military and commercial platforms across the globe. We embrace innovative and progressive ideas to advance our products for military and commercial customers. The Electronic Systems Segment (ESS) provides a broad range of aerospace systems, security and detection systems, and pilot training.   L3 Fuzing & Ordnance Systems (L3 FOS) is the largest fuze manufacturer in the United States and is one of the most advanced manufacturers of Fuzing and Ordnance products in the world.   As an employer of choice, we are in search of a Surface Mount Technology Process Engineer ( Circuit Card Assembly manufacturing ). This job would be part of the Automated Electronics area, which is responsible for all circuit card assembly operations, including both automated processes (selective solder, depanel, in-circuit testing, functional testing, cleaning, conformal coating, etc.) and manual processes (labeling, hand soldering, wiring, adhesives, mechanical assembly, press-fit installation, etc.).   This position would be the manufacturing engineer specifically responsible for circuit card assembly (CCA) processes, including both automated and manual processes.   Job duties  Design and setup manufacturing processes, procedures and production layouts for circuit card assemblies, equipment installation and lean processing  Troubleshoot and analyze manufacturing production problems related to materials, product design, tooling and equipment  Support established production programs and new product introduction  Maintain J-STD-001 certification and/or IPC-A-610 certification  Interface with customers and present status and projects to management  Process owner duties:  o Production support and troubleshooting  o Supplier/customer interface  o Design for manufacturability reviews  o Develop calibration and maintenance requirements  o Design and validation of tooling and fixturing  o Create and execute operator training programs  o Create and maintain work instructions  o Support quoting and proposals  o Monitor process performance (metrics/SPC/CARs/NCs), investigate root causes and implement permanent corrective actions  o Equipment selection, installation, validation and optimization    Process owner responsible for some ( not all ) of the following processes:    o SMT assembly (screen print, SPI, pick and place, AOI, reflow, conveyors)  o Selective Solder and THT component installation/soldering  o J-STD-001/IPC-A-610 inspection  o Hand soldering, touch up, rework  o BGA rework and x-ray inspection  o Inline and Batch cleaning  o Depanel  o Flying probe and/or bed of nails in-circuit testing  o Automated conformal coat application, curing, masking, touch up and inspection  o Adhesive application and curing (staking, underfilling, bonding, encapsulation, etc.)  o Press-fit installation of hardware, connectors, etc.  o Labeling, 2D barcodes, UID  o Other circuit card assembly processes Requirements A four (4) year technical degree (electrical, mechanical, aerospace or manufacturing engineering preferred) and five (5) years minimum experience working in CCA/electronics manufacturing, or equivalent combination of experience and education Knowledge and understanding of engineering drawings and root cause analysis Familiarity with geometric dimensioning and tolerancing preferred Experience leading continuous improvement projects in a manufacturing environment Good communication, technical writing, and technical presentation skills Advanced computer skills to support multiple electronic interfaces and software platforms Familiarity with J-STD-001 / IPC-A-610 Basic understanding of Lean principles and 5S   101367
Salary Range: NA
Minimum Qualification
5 - 7 years

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